| abstract |
A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R 2 2Si0 2/2 )b, (R 2 Si0 3/2 )c, (Si0 4/2 )d, (R 1 )f, and (R 2 3SiO 1/2 )g, where each R 1 is independently an oxygen atom or a divalent hydrocarbon group; each R 1 is independently divalent hydrocarbon group; each R 2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3. |