http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8153523-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8b7ce0a5e2290deb9b124ef4412f33c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f9e51c2da94bfd21eee4aad0aade7645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f5ab17ab18169759e4277e102873a395
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-517
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
filingDate 2009-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2012-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b68b284a6ccd6cf13bc2a933cbab581
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9c3759760109305838924770fda97e8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa199240f8e57083f9ff2e916d8538f7
publicationDate 2012-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8153523-B2
titleOfInvention Method of etching a layer of a semiconductor device using an etchant layer
abstract A method of semiconductor fabrication including an etching process is provided. The method includes providing a substrate and forming a target layer on the substrate. An etchant layer is formed on the target layer. The etchant layer reacts with the target layer and etches a portion of the target layer. In an embodiment, an atomic layer of the target layer is etched. The etchant layer is then removed from the substrate. The process may be iterated any number of times to remove a desired amount of the target layer. In an embodiment, the method provides for decreased lateral etching. The etchant layer may provide for improved control in forming patterns in thin target layers such as, capping layers or high-k dielectric layers of a gate structure.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9064801-B1
priorityDate 2008-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6525009-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005058929-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006263520-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004112868-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3156593-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7098143-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7129182-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005012975-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID82848
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID166601
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22646036
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452894838
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450406353
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453621816
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159433
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID162195831
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159434
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450354107
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449693299
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID158731258
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID166054
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557764
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453010884
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID31170
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452908191
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454632522
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707642

Total number of triples: 47.