Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_886c8bab26bcd969d3e266d1e89aca6b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eece3f4c4266dfce4fc469ddcb3eb4e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8f0c41848d1017af75b141501af2229a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_77e2a12d9b75efdccd80a77788bb2bf7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-56 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-188 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4064 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
2009-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2011-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdccda1fa23c8219bd76b7ec42902139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd72197b43959d91fdb9a08ea3c1a926 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfed9efaa4e210110957a2d3c6aa6b00 |
publicationDate |
2011-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8084519-B2 |
titleOfInvention |
Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition |
abstract |
A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), R 1 and R 2 each represents a hydrogen atom or an alkyl group.) |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11059967-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10287466-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11584823-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10544339-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020194076-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020194182-A1 |
priorityDate |
2008-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |