http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8080505-B2

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
filingDate 2009-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba1420b0f93fd9b55d132df1f617fe66
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publicationDate 2011-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8080505-B2
titleOfInvention Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals
abstract The present invention is related to a slurry composition for polishing copper integrated with tungsten containing barrier layers and its use in a CMP method. The present invention is also related to a method for polishing copper integrated with tungsten containing barrier layers by means of an aqueous solution containing abrasive particles, an inorganic acid such as HNO 3 as etchant for copper that prevents galvanic corrosion of the tungsten containing metal barrier and at least one organic compound to provide sufficient copper corrosion inhibition.
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priorityDate 2004-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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