| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_96bd75d1c09fb52f7bf01152557e4d7a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1eb9cd2af2f87dcf20b0fbbdfe79996e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bf3e6ad6789d40b1b093ca125558ea0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_56b3d52355cef6de7e544bd4bd8d21ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e1bb92dbf6711c456d539ec93c2d987 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2009-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9544205eafb10269978c220c14c3fe23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e14c580e751efcde93e8dba70031ef5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70a242ed6a51e2c15dd24f6059950bfb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2467cb975a1e4e3d803bf20712e64a0 |
| publicationDate |
2011-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8076241-B2 |
| titleOfInvention |
Methods for multi-step copper plating on a continuous ruthenium film in recessed features |
| abstract |
Methods are provided for multi-step Cu metal plating on a continuous Ru metal film in recessed features found in advanced integrated circuits. The use of a continuous Ru metal film prevents formation of undesirable micro-voids during Cu metal filling of high-aspect-ratio recessed features, such as trenches and vias, and enables formation of large Cu metal grains that include a continuous Cu metal layer plated onto the continuous Ru metal film. The large Cu grains lower the electrical resistivity of the Cu filled recessed features and increase the reliability of the integrated circuit. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011318505-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8835315-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014367755-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012217560-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9147685-B2 |
| priorityDate |
2009-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |