| abstract |
In a semiconductor device ( 1 ), a package board ( 2 ) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads ( 5 ) arranged in a matrix are provided to the uppermost wiring layer of the package board ( 2 ), and solder bumps ( 7 ) are connected to the mounting pads ( 5 ). A semiconductor chip ( 9 ) is mounted on the package board ( 2 ) via the solder bumps ( 7 ). The uppermost wiring layer of the package board ( 2 ) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher. |