| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86db4c42c096ec44bdb3505d24eaa609
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e47f2c34a03ac52cbc0de03d4029f5ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_769c1313a87d4b21c393851c3c0704bc |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B55-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B55-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B51-00 |
| filingDate |
2010-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bb5db77d4e7168fb4de0810440f3f4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1237faa6f9af3821ab709bb13a81a5f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66c79085de79a4ff70683b172fb68596 |
| publicationDate |
2011-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8057280-B2 |
| titleOfInvention |
Chemical mechanical planarization apparatus |
| abstract |
A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure. |
| priorityDate |
2007-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |