Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09536 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09745 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
filingDate |
2008-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2011-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b684681406f6a3d3a11d0d1334d5cafe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eda33f0f473d3590f86a61a4a81271d1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_772dfed386c7c0d8a559bd366438f64a |
publicationDate |
2011-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8030579-B2 |
titleOfInvention |
Multilayer printed wiring board |
abstract |
An object of the present invention is to provide a multilayered printed circuit board having a short wiring distance of the conductor circuits, wide option of the design of the conductor circuits and additionally excellent in reliability since cracking scarcely takes place in the interlaminar resin insulating layers in the vicinity of via-holes. The present invention is a multilayered printed circuit board comprising: a conductor circuit and an interlaminar resin insulating layer serially formed on a substrate in alternate fashion and in repetition, wherein a connection of the conductor circuits through the interlaminar resin insulating layers is performed by a via-hole, wherein via-holes in different level layers among the via-holes are formed so as to form a stack-via structure, and wherein at least one of the land diameters of the above-mentioned via-holes in different level layers having the stack via structure is different from the land diameters of other via-holes. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8324512-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9040843-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011108311-A1 |
priorityDate |
2001-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |