| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_646018b7183a929bbb6e26dcdb62a8da |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-22 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-14 |
| filingDate |
2009-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aaaaed343e628227448de962cd0f491f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f444ae391e2b5b87ce30853cd9d124b8 |
| publicationDate |
2011-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8020745-B2 |
| titleOfInvention |
Solder ball |
| abstract |
An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball. The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group. |
| priorityDate |
2008-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |