http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8017674-B2

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-04
filingDate 2007-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_820fd123bb138796591b97cf5fb9b9f5
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publicationDate 2011-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8017674-B2
titleOfInvention Heat-conductive adhesive
abstract The invention provides a heat-conductive adhesive with high heat spread properties and excellent handleability. A pitch-based carbon fiber filler with high thermal conductivity and a smooth surface is combined with an adhesive resin to produce a heat-conductive adhesive with controlled viscosity and excellent handleability.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10494556-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017299807-A1
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priorityDate 2006-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 31.