| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09C1-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-02 |
| filingDate |
2009-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1b04078b4f3d5acb583f42822146897
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a40d349f03617619ed73ebcb7fd90686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1ad3e8d897abeccfd95c13d0e0427ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01cd19963303720d983c66c36402f1e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f10aaf0644c32782110d35efc1b73760
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31ed0e7191632a5f9009755f39fe3f4c |
| publicationDate |
2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8002860-B2 |
| titleOfInvention |
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive |
| abstract |
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate comprising polishing a film to be polished by moving a substrate on which the film to be polished is formed and a polishing platen while pressing the substrate against the polishing platen and a polishing cloth and supplying the CMP abrasive between the film to be polished and the polishing cloth, a method for manufacturing a semiconductor device comprising the steps of the above-mentioned polishing method, and an additive for a CMP abrasive comprising an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished, and water. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10926378-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9604339-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8425276-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010267315-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9039488-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8845394-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9233452-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11691241-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9011207-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8998678-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8998677-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9199354-B2 |
| priorityDate |
1999-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |