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publicationDate 2011-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7994043-B1
titleOfInvention Lead free alloy bump structure and fabrication method
abstract A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the first solder component layer. The patterned resist layer is removed. The first solder component layer and the second solder component layer are reflowed to form a lead free binary metal alloy solder bump electrically connected to the bond pad.
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