Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0454b8157065aa79e639d913ec748f6b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11502 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05564 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11901 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-119 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05186 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
filingDate |
2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2011-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b216a5a793227b296616fa89b6b06cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7afee3e17f1ebbb7e525d720f153ba7 |
publicationDate |
2011-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7994043-B1 |
titleOfInvention |
Lead free alloy bump structure and fabrication method |
abstract |
A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the first solder component layer. The patterned resist layer is removed. The first solder component layer and the second solder component layer are reflowed to form a lead free binary metal alloy solder bump electrically connected to the bond pad. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012295434-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8980739-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10304697-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10832921-B2 |
priorityDate |
2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |