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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
filingDate 2010-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e21546b63609a1337d3e791540170228
publicationDate 2011-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7988470-B2
titleOfInvention Methods of fabricating metal oxide or metal oxynitride TFTs using wet process for source-drain metal etch
abstract The present invention generally relates to thin film transistors (TFTs) and methods of making TFTs. The active channel of the TFT may comprise one or more metals selected from the group consisting of zinc, gallium, tin, indium, and cadmium. The active channel may also comprise nitrogen and oxygen. To protect the active channel during source-drain electrode patterning, an etch stop layer may be deposited over the active layer. The etch stop layer prevents the active channel from being exposed to the plasma used to define the source and drain electrodes. The etch stop layer and the source and drain electrodes may be used as a mask when wet etching the active material layer that is used for the active channel.
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