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filingDate 2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_764efb8a419bc31afc25556af1f77784
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publicationDate 2011-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7986027-B2
titleOfInvention Encapsulated metal resistor
abstract The method provides a semiconductor structure and method for forming such a structure that provides for protection for resistive layers formed within the structure from contamination from adjacent layers. By encapsulating the resistive layer in a material that is resistant to the diffusion of contaminants it is possible to protect the resistive material during the processing required to manufacture the structure.
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