| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_070875329d2add3d65875c6c1b27108a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-40 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F232-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F36-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F8-00 |
| filingDate |
2007-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bcd98f40bd400786e17135b0470c175b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1d0219daf037a16e11217cb35d9d01c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa5682ef04e00c7491c6616ef0c39980
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c976dd7ef8b4e0761a189743339319fe |
| publicationDate |
2011-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7964671-B2 |
| titleOfInvention |
Thermally curable composite resin composition, prepreg, composite film and laminated material for circuit having the same |
| abstract |
The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105062070-A |
| priorityDate |
2007-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |