http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7951615-B2

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filingDate 2009-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_416cc40e685e9d66d3d01030085826c6
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publicationDate 2011-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7951615-B2
titleOfInvention System and method for implementing multi-resolution advanced process control
abstract One embodiment is a method for fabricating ICs from a semiconductor wafer. The method includes performing a first process on the semiconductor wafer; taking a first measurement indicative of an accuracy with which the first process was performed; and using the first measurement to generate metrology calibration data, wherein the metrology calibration data includes an effective portion and a non-effective portion. The method further includes removing the non-effective portion from the metrology calibration data and modeling the effective portion with a metrology calibration model; combining the metrology calibration model with a first process model to generate a multi-resolution model, wherein the first process model models an input-output relationship of the first process; and analyzing a response of the multi-resolution model and second measurement data to control performance a second process.
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Total number of triples: 24.