| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2002-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-17 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F17-235 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01F17-235 |
| filingDate |
2006-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf4b475193cd8c88f7cc297ea888af82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ebbd82b7bcc31ec522588c9bd27676f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cada59de3614cabfb7448851e16544ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_491ad46815173d237dc563186fc0be82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30a989e796bcb6b87339688b60d64c99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebe03b00496ac25a8646bed1002f52fa |
| publicationDate |
2011-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7867461-B2 |
| titleOfInvention |
Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same |
| abstract |
The present invention relates to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same, and more particularly, to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same in which the specific surface area of the powder is increased by preparing a cerium precursor, and then decomposing and calcinating the prepared cerium precursor. The pore distribution is controlled to increase the chemical contact area between a polished film and a polishing material, thereby reducing polishing time while the physical strength of powder is decreased, which remarkably reduces scratches on a polished film. |
| priorityDate |
2005-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |