| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-106 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate |
2009-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef4999edd20864c3aa3de1efe2865744
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f2c592f059b334dd002b4b5283c6cad |
| publicationDate |
2011-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7866037-B2 |
| titleOfInvention |
Metallization forming method |
| abstract |
A metallization forming method comprises the steps of: patterning a silver halide emulsion on a surface of at least one side of a substrate in accordance with a desired metallization pattern to form a patterned emulsion layer; exposing the patterned emulsion layer; and thereafter developing the exposed patterned emulsion layer to form a patterned conductive silver layer having the metallization pattern. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012177817-A1 |
| priorityDate |
2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |