Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05B7-22 |
filingDate |
2007-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2010-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7c01740190a089b7ad29aa75c8eb310 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2933a65403084a43bccadef442df49f7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b037ae3b6c929fa0611932e64368a445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_298b43897096b7731d4da65c12045aa7 |
publicationDate |
2010-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7858146-B2 |
titleOfInvention |
Method of electrolessly depositing metal on the walls of through-holes |
abstract |
Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9499912-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9518324-B2 |
priorityDate |
2007-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |