| abstract |
The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness. n The adhesive composition of the present invention comprises:n (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound having a specific side chain. |