| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c4b5184b7a8fe02a0c2cc4e509230214 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2375-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2270-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4825
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 |
| filingDate |
2006-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3cde7106cdc72462d7d4d3de6a03f57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_640b6337f876d0a86b1a6a0d4d3e6e21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8aa277d9f27f6e4cf9990a5db5908f46 |
| publicationDate |
2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7833297-B2 |
| titleOfInvention |
Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein |
| abstract |
Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9238296-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9238295-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012178349-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014357163-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014357170-A1 |
| priorityDate |
2005-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |