| abstract |
A semiconductor device ( 100 ) comprises a first resin substrate ( 101 ) on which a first semiconductor chip ( 125 ) is mounted a surface thereof; a second resin substrate ( 111 ) on which a second semiconductor chip ( 131 ) is mounted on a surface thereof; and a resin base material ( 109 ), joined to a front surface of the first resin substrate ( 101 ) and to a back surface of the second resin substrate ( 111 ), so that these surfaces are electrically connected. The resin base material ( 109 ) is disposed in a circumference of the first resin substrate ( 101 ) in the surface of the first resin substrate ( 101 ). Further, the first semiconductor chip ( 125 ) is disposed in a space section provided among the first resin substrate ( 101 ), the second resin substrate ( 111 ) and the resin base material ( 109 ) in the surface of the first resin substrate ( 101 ). |