| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03K19-173 |
| filingDate |
2009-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd212bd3215bacfcf8e6c376daf34b47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c948323e88c5f712715398286e38d72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f540c6904841254d4892a4305218094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3f3c1c26e2a4aed956100dc122f172c |
| publicationDate |
2010-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7816945-B2 |
| titleOfInvention |
3D chip-stack with fuse-type through silicon via |
| abstract |
Programmable fuse-type through silicon vias (TSVs) in silicon chips are provided with non-programmable TSVs in the same chip. The programmable fuse-type TSVs may employ a region within the TSV structure having sidewall spacers that restrict the cross-sectional conductive path of the TSV adjacent a chip surface contact pad. Application of sufficient current by programming circuitry causes electromigration of metal to create a void in the contact pad and, thus, an open circuit. Programming may be carried out by complementary circuitry on two adjacent chips in a multi-story chip stack. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012043666-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8847399-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9318414-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9324655-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8921167-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9318413-B2 |
| priorityDate |
2009-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |