| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0f26a9c2efad3ae086a108f3c04b57d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4827 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-482 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-482
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2008-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6ebae9445cb18eefc80654c48547eaf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a469064c030d31c4f508628814f69a99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d004c8e9cfe7c3f0373c9c5ba088b5a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96037e2dec0e8e615ebc0472ceb97b8b |
| publicationDate |
2010-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7795126-B2 |
| titleOfInvention |
Electrical die contact structure and fabrication method |
| abstract |
A semiconductor device of the invention includes an integrated circuit formed on a semiconductor substrate having first and second surfaces and a notch region along the edges. The first surface includes electrical contact pads electrically connected with the integrated circuit. The first surface of the semiconductor substrate includes a top protective layer that has a surface portion extending beyond the edges of the semiconductor substrate. The second surface of the semiconductor substrate includes a bottom protective layer with electrical connectors. The surface portion of the top protective layer includes electrical contact pads that are electrically interconnected with electrical contact pad extensions. The electrical contact pad extensions are interconnected with electrical connectors via a backside electrical connector that overlaps the electrical contact pad extensions forming a lap connection. Methods for constructing such devices and connections are also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010102460-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9787254-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9871107-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9509251-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013330855-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10075132-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017256432-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8802463-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8945960-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8945963-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8802470-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8598720-B2 |
| priorityDate |
2002-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |