| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bcd47feabc20e75f1113da78708f261b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12493
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0234 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate |
2008-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f480f631710f8aa34680a824e9be264f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_947f4bcc15f8fd5f75453023ef13c2bd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9dfae616f35def979a222280379f13c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bbecf51bcb3aa0a5a7ae84c51ca9665 |
| publicationDate |
2010-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7791897-B2 |
| titleOfInvention |
Multi-layer embedded capacitance and resistance substrate core |
| abstract |
A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10660209-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9955568-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10497648-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10595397-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10700035-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10553556-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11388821-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9966361-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9966371-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10770444-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015216046-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8446707-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011006393-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10312194-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7911029-B2 |
| priorityDate |
2008-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |