| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-176
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0338 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
2008-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65e02b3745725a2d131d20ce3b9cf773
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0316550073b4f1af6c69117d3e322ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9c48cc68999c00507eddfda654c06d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8bb6dc17fa94ab133f3d433e2d11e59 |
| publicationDate |
2010-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7781232-B2 |
| titleOfInvention |
Method to recover underfilled modules by selective removal of discrete components |
| abstract |
Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9673182-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9397062-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11330746-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8492171-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8928134-B2 |
| priorityDate |
2008-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |