http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7754612-B2

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
filingDate 2007-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32114ad69a306fc76da1c82a0f0c1d7e
publicationDate 2010-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7754612-B2
titleOfInvention Methods and apparatuses for removing polysilicon from semiconductor workpieces
abstract Methods and apparatuses for removing polysilicon material from a semiconductor workpiece are disclosed. A particular method includes contacting a polishing pad with a semiconductor workpiece having a surface polysilicon material. The method also includes disposing a polishing liquid between the polysilicon material and the polishing pad. The polishing liquid contains an oxidizer that does not include metal elements. The method further includes moving at least one of the semiconductor workpiece and the polishing pad relative to the other while the semiconductor workpiece contacts the polishing pad and the polishing liquid. At least some of the polysilicon material is removed while the polysilicon material contacts the oxidizer in the polishing liquid, as at least one of the semiconductor workpiece and the polishing pad moves relative to the other.
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