http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7750444-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62cde03192748a8ed36c2a5b6b1c608 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4951 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate | 2008-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8afd3138b879563b3fc59c597658bb1c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93b463e27140445ba7d8575260f008e5 |
| publicationDate | 2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7750444-B2 |
| titleOfInvention | Lead-on-chip semiconductor package and leadframe for the package |
| abstract | A LOC semiconductor package with the leadframe for the package is revealed. The LOC semiconductor package primarily comprises a plurality of leadframe's leads, at least a tie bar, a chip, and an encapsulant encapsulating the components mentioned above. Each lead has a bonding finger. The tie bar has a dummy finger where the dummy finger is linearly disposed at one side of the disposition area of the bonding fingers. The chip has an active surface with the bonding fingers. When the dummy finger and the bonding fingers are disposed above the active surface by a die-attaching layer, the dummy finger is adjacent to one edge of the active surface. The bonding fingers are electrically connected with the bonding pads. The dummy finger will bear the concentrated stresses to avoid the bonding fingers on the active surface to delamination or break due to external stresses and to avoid the interference to the layout of the leads. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014374892-A1 |
| priorityDate | 2008-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.