http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7723759-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34
filingDate 2005-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_561604dec96a7d38e760d84eb07b601d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11f1b855bbe9ed089695f5a405d556bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16b1792832fe56ebf1efe190ee69755f
publicationDate 2010-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7723759-B2
titleOfInvention Stacked wafer or die packaging with enhanced thermal and device performance
abstract An apparatus includes a metallization region including a plurality of metal layers on a device layer of a substrate, a via extending through the substrate and the device layer, and a heat spreading and stress engineering region in the substrate and adjacent to the device layer. The via contacts a metal layer in the metallization region.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012045871-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11257753-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10998228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8524539-B2
priorityDate 2005-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006103008-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003038344-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002038908-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002113288-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005087864-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005014311-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 48.