| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc905cbef116a1ec61d12125af9427f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2291-0255
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2291-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2291-0426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2291-0427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-5027 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-022 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N29-04 |
| filingDate |
2006-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf7b1166e414455dc0d56415da2f2166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6836a0c66cb23b80bb1e6d300c43f659
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545d90e11ac90ad65394949956a8a157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbd440bac3ae0cda851b9a8234298fe6 |
| publicationDate |
2010-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7716986-B2 |
| titleOfInvention |
Acoustic wave sensing device integrated with micro-channels and method for the same |
| abstract |
An acoustic wave sensing device integrated with micro-channels and a method for the same are described. The present invention uses a piezoelectric substrate with a thinner portion serving as a sensing area and formed via a micromaching or chemical process. An inter-digital transducer (IDT) is located on the thinner portion to produce flexural plate waves (FPW). The micro-channels can be formed together with the thinner portion via the same manufacturing process, or integrated into the piezoelectric substrate via linkage. In the present invention, a novel manufacturing process and design are proposed for fabrication of the acoustic wave sensing devices with a good piezoelectric characteristic, a stable temperature compensation property, and a robust structure. Thereby, the techniques of flexural plate waves can be applied for liquid sensors. In this way, the drawbacks of the conventional acoustic wave sensing devices, such as poor piezoelectric properties and fragile film structures, are removed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009102316-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9121864-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3280050-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7868517-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013125652-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10627367-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018222119-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016159112-A1 |
| priorityDate |
2005-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |