| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0284 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-103 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J5-20 |
| filingDate |
2006-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cdc7a0a9e2db80fbd33f06171516ea6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6f923e8be18bc7d3de375e9b0759f62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06a9074c54216efc1443b0cbc08736b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c77072736042e1b92383a987e74bde5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f0eef6174addfe2d02b7ddb5ae39934
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f502e10d7995e65622e9a990588674cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dbba56f8a269ed9f5c8855ff9af4b24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d945bef8c6540c33e09186253f5a20b |
| publicationDate |
2010-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7709795-B2 |
| titleOfInvention |
Infrared sensor unit and process of fabricating the same |
| abstract |
An infrared sensor unit has a thermal infrared sensor and an associated semiconductor device commonly developed on a semiconductor substrate. A dielectric top layer covers the substrate to conceal the semiconductor device formed in the top surface of the substrate. The thermal infrared sensor carried on a sensor mount which is supported above the semiconductor device by means of a thermal insulation support. The sensor mount and the support are made of a porous material which is superimposed on top of the dielectric top layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11031432-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11506599-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10605667-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11718337-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11465665-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019148443-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021404878-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9293494-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10270002-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11320313-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11590994-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10453985-B2 |
| priorityDate |
2005-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |