patent/US-7705458-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7705458-B2

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C45-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
filingDate	2006-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2010-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59de06fa380dfc76fc92b05099ef2c93 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75887934c3df2988b548e35f0fc5e776
publicationDate	2010-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-7705458-B2
titleOfInvention	Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
abstract	A foamed bulk metallic glass electrical connection is formed on a substrate of an integrated circuit package. The foamed bulk metallic glass electrical connection exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed bulk metallic glass electrical connection is used as a solder bump for communication between an integrated circuit device and external structures. A process of forming the foamed bulk metallic glass electrical connection includes mixing bulk metallic glass with a blowing agent.
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priorityDate	2006-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 83.