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publicationDate 2010-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7690106-B2
titleOfInvention Ceramic header method
abstract A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.
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