http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7683138-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f76aab74ed312003383a8600e2edbd5b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2005-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8a469c41abb4a12e819bdaa47626db3 |
| publicationDate | 2010-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7683138-B1 |
| titleOfInvention | Molding compositions |
| abstract | A curable composition exhibiting excellent moldability without mold staining or delamination is provided, including an epoxy resin, a curing agent for the epoxy resin, and a polyphenylene oxide compound having a glass transition temperature between about 165° C. and about 190° C. The polyphenylene oxide compound may be provided as a melt blended mixture of two polyphenylene oxide compounds having distinct glass transition temperatures. The curable compositions may further include a bulk filler, and are therefore particularly useful as molding compounds encapsulation of electrical and/or electronic parts in transfer molding operations. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9808970-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8900710-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008187762-A1 |
| priorityDate | 2005-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 140.