Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-906 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
filingDate |
2006-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a427a367ddcbe37a50aae7fa4ae540 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb6c954b6e87f6c184e7d8ac6ac8f081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_429a2135cd03010f5d8e3d80d79c9ace |
publicationDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7678699-B2 |
titleOfInvention |
Method of forming an insulating capping layer for a copper metallization layer by using a silane reaction |
abstract |
A new technique is disclosed in which a barrier/capping layer for a copper-based metal line is formed by using a thermal-chemical treatment with a surface modification on the basis of a silicon-containing precursor followed by an in situ plasma-based deposition of silicon nitride and/or silicon carbon nitride. The thermal-chemical treatment is performed on the basis of an ammonium/nitrogen mixture in the absence of any plasma ambient. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010221911-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10163697-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10411119-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9673091-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8153524-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9859218-B1 |
priorityDate |
2005-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |