Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C1-4989 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M2205-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M2205-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-41 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C5-08 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-46 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C8-00 |
filingDate |
2008-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_321958d45841c013341cc64248da02bc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac22369a1639e7ccaa9025cf89b4be69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4e79f6025fa932b09e709ea72848764 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_021dc7bdca8dc70bb0f5a9eef402eda4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66c1f4dd614d057169654d4453ad5477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df6b1a60aae7cf76f5a4077dda7d523c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65c4d14da36b49c0220de7048f977cf4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f92f6bc13101a801f095afaa1c4150f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a46979785af0d366b1b95d4a1e04e30 |
publicationDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7678526-B2 |
titleOfInvention |
Radiation curable thermal transfer elements |
abstract |
Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8846168-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014020824-A1 |
priorityDate |
2005-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |