| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5e4c48663fb899e6ce58f22de5af1d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45664 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate |
2006-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5edcef9e9836cbeb4ba8f5366162ee6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b04c3f8957a66f119ecae2ba34cbeb0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_279e9d63652b0f0a7565f0e2e7982321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feaba334864d74b0b6031131b1f76b25 |
| publicationDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7678183-B2 |
| titleOfInvention |
Electroless palladium plating bath and electroless palladium plating method |
| abstract |
Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10947623-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8562727-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017121823-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012186852-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012118196-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9758874-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2784182-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9617644-B2 |
| priorityDate |
2005-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |