| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa06d27c4f6bdabc0287dbe24bc8b627 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2105-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G15-6582 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-075 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-56 |
| filingDate |
2006-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8ee70cbf05c8e5977698e3abbad3636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_189db0b9323dbcdf6b84b09312a70b86 |
| publicationDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7677943-B2 |
| titleOfInvention |
Manufacturing of a photo-radiation source by binding multiple light emitting chips without use of solder or wiring bonding |
| abstract |
A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10872998-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9419142-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9627594-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-202012000683-U1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011180818-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8461602-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10795241-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9306132-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8210697-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9799811-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10818703-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009256472-A1 |
| priorityDate |
2004-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |