| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09881
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30 |
| filingDate |
2008-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a942c5bbdc2742a2ccc0d45f8b490439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5632c16d53c63dfbe747b3588b92bfee |
| publicationDate |
2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7676913-B2 |
| titleOfInvention |
Wiring board, method of manufacturing wiring board, and electronic device |
| abstract |
A method of manufacturing a wiring board includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink jetting so as to cover a part of the first wiring layer and expose an exposed section of the first wiring layer; and forming a second wiring layer by ink jetting partly over the first wiring layer, with the first insulating layer being between the part of the first wiring layer and a part of the second wiring layer. A wider variety of conductive material and insulating material can be used for forming the wiring layers and the insulating layers on the substrate by ink jetting, while the wiring board has a first wiring layer having high density. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008238983-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11090858-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11191167-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017203508-A1 |
| priorityDate |
2004-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |