| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-151 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 |
| filingDate |
2006-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a318fd5379a1af7994a569d218b26f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b09c914184de81ec61f75e4eecdd655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a9587b4d3ea4e81ff00f1f579871501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b0f77a9585bcc05effbd176158954cc |
| publicationDate |
2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7662542-B2 |
| titleOfInvention |
Pattern forming method and semiconductor device manufacturing method |
| abstract |
A pattern forming method includes the following steps. A resist pattern is formed on a to-be-processed film. A mask pattern including the resist pattern and a resin film formed on a surface of the resist pattern is formed. Slimming of the mask pattern is executed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9039910-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8097398-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009305167-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8962224-B2 |
| priorityDate |
2005-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |