| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33ce75f88c73fc5edcab777805a73fc1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e041e70f9ce5e735b3c2ba6c386ba4e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-7598
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4803
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B30B15-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2007-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5fabb3f32063111e7843f8ec764317a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1332787565328f295a2f2bb8faeba71 |
| publicationDate |
2010-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7659182-B2 |
| titleOfInvention |
Method of wafer-to-wafer bonding |
| abstract |
Methods of wafer-to-wafer bonding are disclosed. These methods use a force-transposing substrate providing redistribution of the applied force to the local bonding areas across the wafer. Certain versions of the Present Invention also provide a compliant force-distributing member along with applying bonding material to bonding areas in select locations. A predetermined sequence of external force loading and temperature steps ensure creating bonds between the wafers in the bonding areas. The disclosed methods improve wafer bonding, by increasing its uniformity and strength across the wafer, increasing both reproducibility and yield process and decreasing cost of semiconductor and MEMS devices. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8778737-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9355936-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9721824-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113513520-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113513520-B |
| priorityDate |
2006-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |