| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e433c1625fc509a087c912b440da84b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2007-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0609406a20bc7aaae84f2331b9bf15f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba2e52d1617f4081b1e8db6b1444e607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e304254f80f5f19561c41e3e0bd84725 |
| publicationDate |
2009-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7635914-B2 |
| titleOfInvention |
Multi layer low cost cavity substrate fabrication for pop packages |
| abstract |
In a method and system for fabricating a semiconductor device ( 100 ) having a package-on-package structure, a base laminate substrate (BLS) ( 110 ) is formed to include a base center portion ( 112 ) and a peripheral portion ( 114 ) separated by a barrier element ( 120 ). The barrier element ( 120 ) forms a peripheral wall ( 118 ) to surround the base center portion ( 112 ). A frame shaped top laminate substrate (TLS) ( 130 ) is disposed over the peripheral portion ( 114 ) of the BLS ( 110 ). The TLS ( 130 ) has an open top center portion ( 132 ) matching the base center portion ( 112 ) surrounded by the peripheral wall ( 118 ) to form a cavity ( 140 ). A plurality of conductive bumps ( 150 ) each disposed between a top contact pad ( 134 ) of the TLS and a base contact pad ( 116 ) of the peripheral portion ( 114 ) of the BLS ( 110 ) are formed to provide electrical and mechanical coupling therebetween. The barrier element ( 120 ) forms a seal between the cavity ( 140 ) and the plurality of conductive bumps ( 150 ). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8373268-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009166887-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10229865-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7867819-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11521947-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8987053-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011095440-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017373029-A1 |
| priorityDate |
2007-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |