patent/US-7594644-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7594644-B2

Outgoing Links

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assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b
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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B25B11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
filingDate	2005-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2009-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b32d98352bb8f31902f186cbe35ae813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94ebea062a3060e4c56d48a65f6620cc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_292c7ca952357473a430a5bef570e798 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87d9e7e9f7a0eb597ed07f3f9154f306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8f830292292bb5f707399c6e5b4b272 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81b0d7a5b363155c26948b6573e4727d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8980688eec5eabbc8fa8a18536e881a
publicationDate	2009-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-7594644-B2
titleOfInvention	Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
abstract	A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
priorityDate	2002-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558564 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777387 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6594 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129420544 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8711 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419517688 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83648

Total number of triples: 49.