| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2479-086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2479-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31725
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-127 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 |
| filingDate |
2005-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82928868123a42c92d55f73d65e6d7cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e3d48c8a81016b74103d0cd18b8adb3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51f4a199cc6483b15e5c02d42a7c00f6 |
| publicationDate |
2009-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7579134-B2 |
| titleOfInvention |
Polyimide composite coverlays and methods and compositions relating thereto |
| abstract |
The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9055700-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8492898-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8995146-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8653512-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8664817-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012228616-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11786930-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010025091-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8692115-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8704416-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8772997-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9648720-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021060612-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021060613-A1 |
| priorityDate |
2005-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |