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publicationDate 2009-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7560165-B2
titleOfInvention Sealing porous dielectric materials
abstract Method and structure for minimizing the downsides associated with microelectronic device processing adjacent porous dielectric materials are disclosed. In particular, chemical protocols are disclosed wherein porous dielectric materials may besealed by attaching coupling agents to the surfaces of pores. The coupling agents may form all or part of caps on reactive groups in the dielectric surface or may crosslink to seal pores in the dielectric.
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