| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 |
| filingDate |
2004-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bacf0bf59ea723df2491c2ee412219f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e39374a4980c6d8506c8d207fdb1197e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf56bb07b0fbe6aaa38edfcfbdfbae94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75766d52026e801b9791420996296877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69e4870542adb88293280fbed47801d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed45e69158e74f0582d4305450df86cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e28b3a5f58154bd1dc5f95edea684eb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63ce5237956ec39f636d4173926e165d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f6d9d51dfdf1fc09ac7717e52efcd08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79cb3306dbc615751be5db23fa574f90 |
| publicationDate |
2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7553400-B2 |
| titleOfInvention |
Plating apparatus and plating method |
| abstract |
A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7777920-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007201105-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8253992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010271671-A1 |
| priorityDate |
2003-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |