| abstract |
A light-emitting diode (LED) assembly includes a circuit board ( 10 ), at least one LED ( 20 ) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus ( 40 ) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole ( 102 ) corresponding to a position of the at least one LED. Thermal interface material ( 140 ) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material. |