| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fc4959f5dd6065724ffd21292b1ce17c |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B33-10 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J1-62 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-40 |
| filingDate |
2006-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_429baf476c82240b07dab1459b56abf8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7523e64d1863b5ee34d11631a24cb9f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ae8b2e4b755bb4892f564a6abb4cdcf |
| publicationDate |
2009-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7535164-B2 |
| titleOfInvention |
Self-emission panel and method of manufacturing same |
| abstract |
A self-emission panel and a method of manufacturing a self-emission panel which can prevent emission failures from occurring due to various factors, thereby achieving a self-emission panel that is free from emission failures. The self-emission panel is manufactured by forming a first conductive layer on a substrate directly or via other layers, forming a deposition layer including a luminescent layer on the first conductive layer, and forming a second conductive layer on the deposition layer. This manufacturing method includes: a first step of forming a sectioning layer for sectioning an opening for making a emission area on the first conductive layer after the formation of the first conductive layer; a second step of applying surface treatment to at least the surface of the first conductive layer inside the opening; and a third step of depositing a deposition layer on the first conductive layer given surface treatment in the second step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101725874-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8324617-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011260154-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009212689-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011260155-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8253132-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8013523-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8274216-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011121718-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011042703-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110058707-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8410684-B2 |
| priorityDate |
2005-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |