| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2007-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_298b43897096b7731d4da65c12045aa7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2933a65403084a43bccadef442df49f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7c01740190a089b7ad29aa75c8eb310
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6af97a650b079805c670be7ecce8f940 |
| publicationDate |
2009-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7527681-B2 |
| titleOfInvention |
Electroless copper and redox couples |
| abstract |
Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8808525-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011180415-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9914115-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9364822-B2 |
| priorityDate |
2006-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |