| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36d1d9c59848bff6ad5f55923d1290f5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2005-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7929d6ef4da22111e19e73697e20197b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d57c3f0cceac9ff1126b6b3f6ad54d1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5287415497ab6d15e38d2745eb26219 |
| publicationDate |
2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7524697-B2 |
| titleOfInvention |
Method for manufactuing a semiconductor integrated circuit device |
| abstract |
A burn-in process for a semiconductor integrated circuit device includes a first process of positioning bump electrodes of the semiconductor integrated circuit device with respect to pads of a socket having detachment mechanisms, a second process of pressing the bump electrodes against the pads by weighting the semiconductor integrated circuit device, and a third process of detaching the bump electrodes from the pads by exerting force on the semiconductor integrated circuit device in a direction opposite to a weighting direction of the second process. Automatic insertion and detachment of a semiconductor integrated circuit chip in a burn-in test is facilitated by detaching the bump electrodes from the pads by pushing up the semiconductor integrated circuit device. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9182443-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014167803-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10288644-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8558391-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9362187-B2 |
| priorityDate |
2004-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |